#AI Infrastructure #Czech Republic #Prague #ModulEdge #Comino

ModulEdge and Comino: A New Era in AI Infrastructure for European Businesses

In a groundbreaking move to transform AI implementation in Europe, Czech modular data center manufacturer ModulEdge has joined forces with Comino, a leading European provider of liquid cooling solutions. Announced on March 24, 2026, this strategic partnership aims to deliver integrated AI infrastructure directly on the client's premises across not only Europe but also the MENA region.

The collaboration addresses a pressing issue known widely among businesses leveraging AI technology: the lengthy traditional acquisition cycles for infrastructure usually spanning 12 to 18 months. During this waiting period, companies often see competitors race ahead, capitalizing on advancements in AI. By merging ModulEdge's modular data centers with Comino's liquid-cooled GPU systems, the new partnership is poised to cut implementation time down to a remarkable 3 to 6 months. Furthermore, it ensures total data sovereignty and local control for the organizations involved.

Comino's GPU options include advanced models such as the RTX Pro 6000, H200, B200, B300, and GB300, designed to handle the growing demands of high-performance computing tasks. The efficiency of Comino's liquid cooling systems is particularly noteworthy, achieving a Power Usage Effectiveness (PUE) rating between 1.05 and 1.1, compared to typical air-cooling solutions that range from 1.4 to 2.0. This stark difference translates into lower operational costs and a significantly reduced carbon footprint.

In a statement, Alexey Chistov, technology director and co-founder of Comino, emphasized: "Companies consistently tell us they need on-site AI computing quickly and without the hassle of managing multiple vendors. Our partnership with ModulEdge allows us to deliver just that—proven liquid cooling technology within a robust and deployable facility that is ready to go."

Echoing this sentiment, Yuri Milyutin, commercial director and partner at ModulEdge, remarked on the evolving conversation surrounding AI infrastructure. "Organizations are no longer questioning whether they need on-premises computing; instead, they want to know how quickly they can deploy it while maintaining security and reliability. Our collaboration with Comino effectively addresses this issue with a verifiable and deployable solution that eliminates the usual 18-month build and permitting times."

As of now, ModulEdge and Comino are accepting orders, with the estimated delivery timeline set to follow the typical manufacturing cycle of 3 to 6 months—a much quicker alternative for businesses eager to pivot towards advanced AI applications.

About ModulEdge

Founded in 2023, ModulEdge specializes in the design and manufacture of modular data centers tailored for high-density computing applications on-site, at the network edge, and in real-world conditions. With over 30 deployments across eight countries, their modules adhere to stringent Tier I-IV standards and accommodate 5 to 150 kW per rack, offering various cooling options, including free cooling solutions. The company’s headquarters is located in the Czech Republic.

About Comino

Comino stands out as an international provider of liquid cooling technologies, backed by over 15 years of experience in high-performance multi-GPU solutions. With its patented contact cooling technology, Comino has effectively cooled more than 20,000 GPUs, FPGAs, and ASICs for over 100 clients worldwide. The company’s product line includes multi-GPU systems, containerized solutions, and integration kits for existing servers, with its main office based in Riga, Latvia.

This partnership between ModulEdge and Comino not only revolutionizes the way businesses in Europe can deploy AI solutions but also sets a new standard for efficiency and speed in tech infrastructure development. The market eagerly watches as these two companies move forward, helping enterprises transition into the AI age more seamlessly than ever before.