#USA #Advanced Packaging #Grapevine #ER Engineering #IEEE ECTC

E&R Engineering's Participation in IEEE ECTC 2025

E&R Engineering Corp. is gearing up for its participation in the prestigious 75th IEEE Electronic Components and Technology Conference (ECTC), which will take place from May 27 to May 30, 2025, at the Gaylord Texan Resort & Convention Center in Texas. This year's conference promises to be a hub of innovation and technological advancement in the field of electronic components and packaging.

At the conference, E&R will showcase its latest solutions in Advanced Packaging. Notable innovations include high-precision laser drilling techniques specifically designed for 2.5D and 3D integrated circuits (ICs), as well as advancements in multi-beam laser applications. E&R is also set to highlight its state-of-the-art plasma systems, known for their exceptional uniformity and thermal stability, a crucial requirement in semiconductor manufacturing.

One of the key features of E&R's presentation will be its comprehensive Flip-Chip Solution, which integrates several critical processes. This includes Pre-Die Bonding and Pre-Underfill Plasma Cleaning procedures, ensuring high-quality assembly of devices. Furthermore, the technology supports On-Boat and Tray Laser Marking, enhancing traceability for highly integrated components, thus addressing a growing demand for improved reliability in semiconductor supply chains.

Leading the charge at the conference will be Kevin Chang, the Marketing Director, and Leo Lee, a Sales Representative. Both individuals bring extensive experience from the North American market and are eager to engage with partners and customers who are equally passionate about advancements in semiconductor technology.

E&R will be exhibiting alongside its respected partner, Scientech, at Booth #438. The company invites all attendees to visit their booth, where they will be demonstrating how their cutting-edge advancements are shaping the future of semiconductor packaging.

For those interested, here are the details for their booth visit:

• - Date: May 27–30, 2025
• - Location: Gaylord Texan Resort & Convention Center
• - Address: 1501 Gaylord Trail, Grapevine, Texas, USA, 76051

This event is an incredible opportunity for industry professionals to witness firsthand the innovations that E&R Engineering is championing in the field of Advanced Packaging. Their commitment to enhancing semiconductor technology is not only beneficial for manufacturers but also paves the way for future technological advancements. Be sure to stop by to learn more about E&R's solutions that influence the dynamics of semiconductor packaging.

For further details, please visit the official E&R Engineering website at E&R Engineering.

Stay updated as E&R continues to pioneer changes in the electronic components sector, illustrating the company's dedication to progress and excellence in advanced packaging technologies.