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JNTC's Groundbreaking Glass Substrate for Semiconductors

On June 30, 2025, JNTC Co., Ltd., a prominent firm in advanced materials, held an exciting product launch at the Korea Exchange Conference Hall. The event introduced their latest innovation: the Through-Glass-Via (TGV) glass substrate, which aims to transform the semiconductor industry. With over 200 attendees including journalists and investors, the launch marked a significant step forward in semiconductor technology.

The CEO, Andrew Cho, highlighted the TGV glass substrate as a revolutionary solution addressing the drawbacks of traditional plastic-based substrates. This new substrate is specifically engineered for applications in artificial intelligence and high-performance computing, boasting remarkable flatness and thermal stability, which are critical for reducing warpage and heat generation during high-speed operations.

In anticipation of the full-scale manufacturing start in August, JNTC completed its domestic production line by June. The company plans to conduct test runs throughout July to ensure quality and efficiency. A unique aspect of JNTC's production process is that most of its core equipment is constructed in-house. This independence not only enhances cost efficiency but also helps minimize initial investment costs—cutting them down to about one-fifth of the industry's average.

The new substrates are designed to accommodate various sizes and thicknesses and feature high-precision via holes that maintain a 0% microcrack rate. JNTC has also developed its own proprietary technologies for etching, metalizing (void-free process), and post-processing, resulting in yields exceeding 90% with minimal defects. The introduction of added features such as alignment marks and cavities has undergone thorough verification in collaboration with global semiconductor leaders.

"TGV glass substrates are becoming integral parts of next-generation semiconductor packaging," stated Cho. "We have positioned ourselves with a distinct advantage in terms of quality and pricing, and we are actively collaborating with 16 global partners within the semiconductor ecosystem. This launch underscores our ambition to emerge as a prominent global competitor in precision glass materials."

Moreover, JNTC is aiming to expand its export capabilities and is planning to establish a large-scale manufacturing facility in Vietnam later this year. This strategic move is set to bolster its already robust standing in the global advanced packaging market, ensuring that JNTC remains at the forefront of innovation in semiconductor technology.

As technology continues to evolve, the introduction of the TGV glass substrate from JNTC represents a significant advancement that could reshape the landscape of semiconductor manufacturing, enhancing capabilities and driving efficiency for companies around the world.