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Compal's Cutting-edge Innovations at the 2025 OCP Global Summit

As the demand for AI computing continues to skyrocket, the energy consumption of data centers has reached unprecedented levels, presenting a significant challenge for cloud service providers and enterprises to balance performance, cost, and sustainability. At the 2025 OCP Global Summit held in San Jose, California, Compal Electronics emerged as a frontrunner in tackling these challenges by showcasing its groundbreaking data center technology blueprint.

An Overview of Compal's Innovations

Compal, a well-established name in high-performance AI server platforms, introduced multiple innovations that highlight its strategic vision for future data center infrastructure. Among these advancements are the CXL-based memory solutions that promise enhanced performance and flexibility, alongside cutting-edge liquid cooling technologies designed to address the thermal demands of high-performance AI workloads.

In an era where mere raw compute power isn’t sufficient, Compal focuses on energy efficiency and scalability. The company has effectively partnered with NVIDIA to meet enterprise needs, helping accelerate the deployment of AI frameworks and shortening time-to-market for new technologies. According to Alan Chang, Vice President of the Infrastructure Solutions Business Group at Compal, “AI has transitioned from being merely a proof-of-concept to a fundamental component of enterprise digital transformation. Our collaboration with NVIDIA integrates compute, networking, and cooling technologies, helping our customers establish scalable and sustainable AI infrastructures.”

What to Expect at the Event

Attendees at the OCP Global Summit are invited to visit Compal’s booth to experience live demonstrations of their latest AI platform, which showcases the integrated solutions powered by NVIDIA. Notably, the demonstrations will include PCIe-based memory pooling technologies built on CXL and RDMA architectures, highlighting innovations in memory expansion and resource allocation. This new architecture promises lower latency and improved overall system performance, making it ideal for next-generation AI applications.

Further enhancing its presentation, Compal will feature impressive memory pooling capabilities along with cache-coherency technologies which showcase their commitment to optimizing AI data center infrastructure. Visitors will gain first-hand insights into how these innovations lead to a more efficient, flexible, and energy-optimized data center ecosystem.

Advanced Liquid Cooling Solutions

One of the highlight features of Compal's presentation includes two state-of-the-art liquid cooling servers designed to handle the intense thermal output from high-performance GPUs. These servers, namely the OG720-2A-L2 ORv3 and the SG223-2A-I, illustrate how the company maintains peak performance and energy efficiency even under maximum load conditions. The performance metrics indicate a potential Power Usage Effectiveness (pPUE) rate below 1.1, representing a significant achievement in energy efficiency for data centers.

Both cooling solutions support high-density AI and high-performance computing (HPC) deployments, offering a scalable framework that drives the future of AI-powered infrastructures.

Conclusion: Shaping the Future of Data Centers

Compal's commitment to driving innovation within the data center space is evident from their comprehensive showcase at the OCP Global Summit 2025. Setting the stage for next-gen data center solutions, Compal not only emphasizes sustainability but also demonstrates a deep understanding of the performance needs of modern enterprises. With the integration of cutting-edge AI, CXL, and advanced liquid cooling technologies, attendees will witness how these advancements shape the performance landscapes of data centers in the future.

As professionals and enthusiasts gather at the San Jose Convention Center, it’s clear that Compal Electronics is a key player in redefining the future of AI-driven data centers. Those wishing to gain further insights are encouraged to engage directly with Compal’s engineering team at Booth C35,