#Japan #Optoelectronics #Silicon Photonics #Chiyoda #CMC Research

Webinar on Optoelectronic Co-Packaging Technology

On July 8, 2025, CMC Research will host an informative webinar titled "An Overview of Optoelectronic Co-Packaging Technology and the Development of Silicon Photonics Integrated Package Boards". The webinar will feature esteemed lecturer, Akihiro Nori, a Senior Researcher at the National Institute of Advanced Industrial Science and Technology (AIST). This online event will begin at 1:30 PM and continue until 4:30 PM (JST).

About CMC Research

Based in Kanda Nishikicho, Chiyoda Ward, CMC Research is dedicated to delivering cutting-edge insights and market trends related to materials and chemicals. In addition to publishing seminars and books, this event aims to shed light on the advancements in the field of optoelectronic co-packaging.

Webinar Objectives

Participants will gain valuable knowledge in the following areas:

• - Key concepts of optoelectronic co-packaging
• - Insights on the current development status and points of interest
• - Introduction to AIST's silicon photonics integrated package board concepts
• - Detailed discussions on development outcomes

Target Audience

This webinar is ideal for researchers, engineers, university students, and graduate students who have an interest in optical implementation, optoelectronic co-packaging technology, and their development trajectories.

Pricing Information

• - General admission: 44,000 JPY (including tax)
• - CMC newsletter subscribers: 39,600 JPY (including tax)
• - Academic pricing: 26,400 JPY (including tax) (Includes materials)

To register for the seminar and for more details, please visit CMC Research Seminar Page.

Seminar Schedule

1. Overview of Optoelectronic Co-Packaging Technology
1.1 Background necessity for optoelectronic co-packaging
1.2 Performance indicators of optoelectronic co-packaging
1.3 Main challenges for optoelectronic co-packaging

2. Global Initiatives in Optoelectronic Co-Packaging

3. Development of Silicon Photonics Integrated Package Boards
3.1 Overview of silicon photonics integrated package board
3.2 Elements of the technology
- Micro-mirrors
- Single-mode polymer waveguides
- Embedded photonic IC technologies
- Optical connectors
3.3 Prototyping the package board
- Thermal analysis
- Prototyping and signal transmission evaluation
3.4 Future challenges

About the Lecturer

Akihiro Nori, Senior Researcher at the National Institute of Advanced Industrial Science and Technology. He holds a Ph.D. from Tohoku University and has worked with AIST since 2014. His research includes the development of silicon photonics packaged micro-mirrors and integrates cutting-edge technologies in the optoelectronic co-packaging field.

Registration and Details

To secure your spot for this enlightening session, visit the CMC Research website for further information and to register. After signing up, participants will receive a Zoom link to access the webinar.

Attend and Engage

This live session will include a Q&A segment, providing attendees an opportunity to engage directly with the lecturer and delve deeper into the topics discussed. Don’t miss this chance to expand your understanding of optoelectronic co-packaging!

Related Upcoming Webinars

CMC Research will also host several other webinars focusing on topics relevant to the cutting-edge advancements in various industries, check the schedule on our website for more details.

Stay ahead in your field by exploring the future potential of technology in this dynamic webinar!