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Beneq Unveils Transform® XP: Revolutionizing Atomic Layer Deposition

Beneq, a frontrunner in Atomic Layer Deposition (ALD) technology, has officially launched its latest innovation, the Transform® XP. Positioned as a second-generation ALD platform, this state-of-the-art system is tailored to meet the escalating demands of Wide Bandgap (WBG) power and RF device manufacturing.

Performance Enhancements and Innovations

Building upon the successful foundation of the original Beneq Transform® platform, the Transform® XP introduces several groundbreaking features. Among these, the enhanced control mechanisms offer faster cycle times and a more extensive range of process capabilities in a high-throughput environment.

One of the standout attributes of the Transform® XP is its flow-optimized 25-wafer mini-batch thermal ALD reactor. This upgrade facilitates remarkable deposition rates, achieving cycle times under ten seconds for common ALD oxides and nitrides. Such streamlined performance is crucial for manufacturers striving to maintain productivity while ensuring the quality of thin films.

Uniformity and Conformality

Refined flow and pressure dynamics enable excellent uniformity throughout the wafer, catering to ultra-thin film applications, even at thicknesses of just a few nanometers. Enhanced precise dwell-time control contributes to exceptional conformality for high-aspect-ratio structures, a common requirement in advanced electronic devices.

Advanced Process Control and Densification

The Transform® XP also incorporates advanced Plasma-Enhanced Atomic Layer Deposition (PEALD) process control. This technology allows for meticulous management of low-energy ions, leading to optimized plasma pre-cleaning and deposition processes. As a result, the quality of the interface improves, delivering tunable passivation properties which significantly enhance the performance and reliability of the devices produced.

The system's integration of in-cycle annealing is another revolutionary feature. This proprietary step is designed to densify and purify films, ensuring the production of stoichiometric materials while achieving crystal alignment, such as AlN lattice orientation. This level of control allows manufacturers to create exceptional materials that meet the rigorous standards of modern device applications.

Responding to Market Demands

Dr. Mikko Söderlund, Head of Sales for Semiconductor ALD at Beneq, remarked, “Transform® XP is our response to the next wave of device challenges in power and RF manufacturing. Our customers have come to trust the original Transform® for its versatility and reliability. With XP, we’re introducing the improvements they specifically requested—better ion control, accelerated cycle times, and the valuable in-cycle film densification—all integrated into a highly versatile platform.”

Beneq's commitment to innovation is evident from the more than dozen Transform® clusters already operating worldwide for WBG pilot and production use. With over 100 process modules shipped, Beneq continues to support leading Integrated Device Manufacturers (IDMs), foundries, and Research and Technology Organizations (RTOs) driving advancements in More-than-Moore technologies.

Conclusion

The release of the Beneq Transform® XP signifies a pivotal moment for businesses involved in the precise and demanding world of semiconductor manufacturing. As technology progresses, the tools and platforms that support it must evolve in tandem. Beneq's Transform® XP not only meets the current needs of the industry but is set to pave the way for future innovations in device performance. Learn more about the Beneq Transform® XP on their official website.