NEXT Semiconductor and BAE Systems Join Forces for Advanced Space-Qualified Chips
In a significant advancement for satellite communication, NEXT Semiconductor Technologies has announced a collaboration with BAE Systems aimed at accelerating the deployment of next-generation ultra-wideband antenna processors. This partnership is positioned to enhance the capabilities of electronic subsystems, making them suitable for high-performance space missions. The innovative antenna processors, known as APUs (Antenna Processor Units), promise to deliver unparalleled efficiency and reliability in processing radio-frequency signals, crucial for future satellite sensors and transmitters.
The centerpiece of this collaboration is the groundbreaking NX450 antenna processor, heralded as the world’s first antenna processor capable of managing up to 200 billion samples per second (200 GS/s) alongside a remarkable instantaneous RF bandwidth of 100 GHz. This processor is designed to transform how signals are acquired and processed, bringing processing capabilities closer to the source, thus redefining electronic warfare functionalities while simultaneously minimizing the size, weight, and power consumption of sensors
Manufactured using the 12 LP (12 nanometer) FinFET process at GlobalFoundries, the NX450 processor integrates embedded redundancy for its application processor and has undergone rigorous testing to achieve radiation qualification, ensuring its durability in the challenging environment of space.
As the demand for satellite networking expands, there is a growing requirement for increased data payloads and enhanced processing abilities in orbit. The NX450 is at the forefront of meeting these needs, introducing System-on-Chip (SoC) solutions that significantly bolster the performance and capabilities of satellite antenna systems. Mike Kappes, President and Chief Strategy Officer of NEXT Semiconductor, emphasized the company's commitment to creating high-reliability, software-defined SoC solutions tailored for future satellite payloads, noting the importance of their collaboration with BAE Systems to support upcoming space missions.
BAE Systems will contribute its expertise to support the NX450 APU's implementation in proliferated low-Earth orbit missions, and they will explore ways to integrate their application-specific integrated circuit technology into future SoC products. Jim LaRosa, BAE Systems' Space Systems program director, highlighted the potential of this partnership, stating that leveraging decades of experience in space electronics allows them to apply advanced radiation-hardened techniques to commercial off-the-shelf products, thereby addressing the increasing performance demands of their clients in the space sector.
The collaboration aims to provide next-generation radiation-hardened solutions, a crucial factor for enabling wide bandwidth capabilities in demanding space missions.
This partnership marks an exciting step forward in the pursuit of reliable and efficient technology for satellite communications, ensuring that both NEXT Semiconductor and BAE Systems remain at the cutting edge of the aerospace and defense sector's technological evolution. As the landscape of space exploration continues to evolve, the integration of such advanced technologies is pivotal for future missions, potentially paving the way for unprecedented advancements in space communication and robotics.
For those keen to learn about the latest in semiconductor technology for space applications, NEXT Semiconductor is making strides with a roadmap for SoC products specifically designed for low-SWaP (size, weight, and power) electronic systems intended for both on-orbit and terrestrial platforms. Evaluation systems of their innovations are readily available upon request, highlighting their commitment to collaboration and development in this exciting frontier of technology.