#Israel #Semiconductor #CoreFlow #CoPoS #Daliat-El Carmel

CoreFlow's Latest Innovation in Semiconductor Handling

CoreFlow Ltd., an esteemed leader in aerodynamic handling solutions tailored for the semiconductor industry, is making waves with the recent introduction of its new 310 mm × 310 mm vacuum stage. This innovative product is specifically designed to address the significant challenges posed by substrate warpage during the CoPoS (Chip-on-Panel) panel-level packaging process.

Many in the industry may not realize the importance of addressing substrate warpage, but it has rapidly ascended to the forefront of manufacturing challenges. As manufacturers push for greater efficiency and higher device densities, the traditional methods of handling semiconductor substrates have begun to show limitations. Recognizing this urgent need, CoreFlow engineered its latest vacuum stage to offer precise flattening of warped glass substrates without the need for clamps.

One of the remarkable advantages of the new CoPoS substrates is their capacity to provide up to 81% more usable area than the conventional 300 mm wafers. This not only promotes improved manufacturing efficiency but also supports demanding applications, particularly those driven by artificial intelligence.

Key Features of the New Vacuum Stage

The advanced 310 mm × 310 mm vacuum stage is derived from CoreFlow's proven technology utilized in current 300 mm wafer flows. Key features include:

• - Clamp-Free Flattening: The innovative design offers accurate flattening of warped substrates without the need for clamps, reducing potential damage and improving process stability.
• - Advanced Aeromechanical Design: This product integrates cutting-edge aeromechanical principles to ensure that flattening occurs efficiently and uniformly.
• - Seamless Integration: The vacuum stage is designed to work harmoniously with existing metrology, lithography, and inspection systems in semiconductor fabrication environments, ensuring that transitions to this new system are smooth and hassle-free.

According to CoreFlow's CEO, Alon Segal, "Substrate warpage has become one of the industry's most critical manufacturing challenges. Our new 310 mm × 310 mm vacuum stage combines our extensive knowledge of silicon wafers and glass substrates, resulting in a product that meets the advanced needs of CoPoS panel-level packaging."

Ordering Information and Availability

The new stage is now available for order in two configurations—Selective Vacuum and GripJet. Customers can also opt for various additional features, including surface finishing, ESD (electrostatic discharge) coatings, and lift-pin assemblies to suit their specific needs. Additionally, the company supports customer-specific modifications to ensure that the vacuum stage meets particular operational requirements.

Delivery typically takes between 8-12 weeks, helping customers to quickly enhance their manufacturing environments for semiconductor applications.

In summary, CoreFlow is not only responding to current challenges faced in the semiconductor industry but is also setting the pace for future innovations. Their commitment to enhancing the efficiency and quality of semiconductor manufacturing is evident in this latest product launch, which promises to help companies achieve greater levels of precision and productivity.

About CoreFlow

Established in 1999, CoreFlow Ltd. has made significant advancements in substrate-handling systems for various industries, including semiconductors and solar. With headquarters in Daliat-El Carmel, Israel, CoreFlow continues to push the boundaries of aeromechanical innovation, supporting clients worldwide with state-of-the-art technologies and solutions. For more details or inquiries about their latest offerings, CoreFlow can be reached through their official website or through their local distributors.