#USA #Advanced Packaging #Grapevine #ER Engineering #IEEE ECTC

E&R Engineering to Showcase Advanced Packaging Innovations at IEEE ECTC 2025

E&R Engineering Corp. is thrilled to announce its participation in the upcoming 75th IEEE Electronic Components and Technology Conference (ECTC), scheduled to be held from May 27 to May 30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas. This notable event, recognized as a premier gathering for industry experts, will serve as a platform for E&R to unveil its latest advancements in semiconductor packaging technologies.

What to Expect from E&R at ECTC 2025

This year, E&R will focus on showcasing cutting-edge solutions in advanced packaging. Among the highlights will be their high-precision laser drilling techniques for 2.5D and 3D integrated circuits (ICs), which promise enhanced performance and reliability in semiconductor applications. Furthermore, attendees will be introduced to E&R’s multi-beam laser applications and plasma systems, which are touted for their remarkable uniformity and thermal stability.

Additionally, the company will present its comprehensive Flip Chip solution. This innovative approach encompasses pre-die joining and plasma cleaning pre-underfill, alongside laser marking on the carrier/tray to ensure high-integrity traceability. These state-of-the-art solutions are designed to meet the evolving needs of the semiconductor industry, reflecting E&R’s commitment to pushing technological boundaries.

Meet the Team

Joining the exhibition will be E&R's Marketing Director, Kevin Chang, and Sales Supervisor, Leo Lee. Both possess extensive experience in the North American market and are eager to engage with partners and clients. Their presence underscores E&R’s mission to strengthen relationships and explore new collaborative opportunities within the semiconductor ecosystem.

E&R will be co-exhibiting at Booth 438, alongside their valued partner, Scientech. We extend a warm invitation to all attendees to visit our booth and discover how E&R's groundbreaking technologies can shape the future of semiconductor packaging.

Event Details

• - Exhibitor Number: 438
• - Dates: May 27-30, 2025
• - Location: Gaylord Texan Resort & Convention Center, 1501 Gaylord Trail, Grapevine, Texas, USA, 76051

For more information, visit E&R's website: ER Engineering.



This participation in ECTC 2025 highlights E&R's ongoing commitment to innovation and excellence in the field of electronic components. As the industry evolves, E&R Engineering Corp. continues to pave the way with its advanced technology and solutions that address the most pressing challenges faced by semiconductor manufacturers.