#USA #Fremont #Yield Engineering #VertaCure XP #AI Semiconductor

Yield Engineering Systems Unveils VertaCure XP G3 for Advanced Packaging Applications

Yield Engineering Systems (YES) has officially announced the launch of the new VertaCure XP G3 systems, designed to revolutionize the production of advanced packaging solutions for AI and HPC (High-Performance Computing) applications. With a focus on low-temperature curing processes, the VertaCure XP G3 is set to make significant waves in the semiconductor industry.

The Innovation Behind VertaCure XP G3

Located in Fremont, California, YES has long been recognized as a leading manufacturer of process equipment tailored for semiconductor solutions. The VertaCure XP G3 is the latest iteration in the VertaCure family, showcasing a fully automated six-zone vacuum curing system. Key features include:

• - Complete Removal of Solvent Residues: Ensuring high purity in the final product.
• - Uniform Temperature Distribution: Essential for consistent performance across multiple RDL (Re-Distribution Layer) layers.
• - Precise Control of Heating and Cooling Rates: Allowing for highly specialized curing processes.

The advanced system guarantees no outgassing post-curing, which traditionally presents challenges within the packaging sector. Additionally, it promises excellent particle performance, achieving a thermal uniformity of ± 1 °C above 200 °C during the hold and heat-up phases. This level of precision is crucial for the polyimide curing of thick films, where even minor discrepancies can lead to significant issues.

A Trusted Automated Solution

Saket Chadda, Senior Vice President at YES, highlights the proven reliability of VertaCure systems in production environments. "The VertaCure provides superior film performance and significantly higher throughput than atmospheric curing systems," he explains. The incorporation of a six-zone temperature control system utilizing laminar flow is key to achieving exceptional uniformity and particle performance, particularly critical for curing polyimides, PBO (Polybenzoxazole), and epoxies.

Moreover, the robust mechanical, thermal, and electrical properties of the system cater to a variety of polymers necessary in Wafer-Level Packaging (WLP) relevant to AI and HPC applications.

Streamlined Manufacturing Processes

Alex Chow, Senior VP of Business Development and Marketing, further elaborates on the operational advantages offered by the VertaCure product line. "Our systems provide a controlled, reproducible, and scalable manufacturing process for both Wafer-to-Wafer and Die-to-Wafer bonding, as well as polymer curing applications. This ensures superior quality while optimizing overall cost of ownership (CoO), particularly for advanced packaging solutions in the semiconductor industry."

Through the introduction of the VertaCure XP G3, YES continues to solidify its position as a market leader in curing technologies, reinforcing its commitment to innovation in the semiconductor and packaging sectors. The company provides state-of-the-art, cost-efficient mass production equipment for advanced packaging solutions that are critical in today's high-performance semiconductor landscape.

For further information about Yield Engineering Systems and its latest innovations, visit YES.tech.

With a growing global presence and a commitment to developing next-generation solutions, YES is positioned to meet increasing industry demands, particularly in the fields of advanced packaging for AI and HPC, storage systems, and biotechnology.