Longsys Unveils Cutting-Edge Edge AI Storage Solutions at COMPUTEX 2026

From June 2 to 5, 2026, COMPUTEX in Taipei saw the unveiling of revolutionary advancements in edge AI storage by Longsys. Under the theme "AI Together," the company showcased its latest full-stack edge AI storage products, designed to optimize the performance of local large language models (LLMs) and facilitate a collaborative AI ecosystem.

AIDIMM™: Pioneering Edge AI Storage

Longsys launched its AIDIMM™ product, which stands out with up to 128 GB capacity, a robust 256-bit bus, and an impressive bandwidth of 307.2 GB/s. This compact module is tailored for AI agents, efficiently addressing common memory, thermal, and upgrade challenges. With its capability to support edge LLMs consisting of over 70 billion parameters, AIDIMM™ promises stable performance through dynamic voltage scaling. This innovation allows low-power, high-performance deployment across a range of applications.

AILPBGA™: Embedded AI Inference Made Efficient

In tandem with AIDIMM™, Longsys introduced AILPBGA™, a high-bandwidth chip dedicated to embedded AI inference. This chip offers 24-64 GB capacities with a bandwidth of up to 307 GB/s, designed in a compact 22x22 mm package. By balancing cost and power consumption effectively, AILPBGA™ provides a viable alternative to traditional high-bandwidth memory solutions used in cloud AI, streamlining development processes and reducing overall costs significantly compared to LPDDR5x memory.

Advanced Integration for Superior Performance

At the heart of Longsys' offerings is the combination of Storage Processing Units (SPUs) and Intelligence Storage Agents (iSAs), enhanced with their innovative HLCache™ technology. This integration aims to optimize DRAM usage and minimize hardware expenses, making it an ideal solution for edge AI compute-storage applications. Demonstrations of this technology on platforms equipped with AMD Ryzen AI Max+ showcased the capability to run complex LLMs smoothly while significantly improving local AI inference experiences.

Enhancing Accessibility in Mobile Applications

Longsys also provided insights into how the HLCache™ technology can boost DRAM scheduling efficiency, allowing mobile devices with lower specifications to execute AI models of varying complexities efficiently. Comparative demonstrations have shown that performance can be achieved on devices with relatively modest memory configurations, enhancing their functionality and extending their lifecycle.

High-Speed Storage Innovations

In addition to AI-centric products, Longsys displayed its Gen4 and Gen5 mSSD solutions. Leveraging wafer-level SiP technology, the Gen5 mSSD promises exceptional sequential transfer speeds of up to 11/10 GB/s and an impressive 2.2 million IOPS. Integrated thermal management, optimized through VC liquid cooling methods, sustains peak performance, setting new benchmarks for the industry.

Lexar’s Contribution to Edge AI Storage

Longsys’ consumer storage brand, Lexar, also made waves by launching AI-Grade Gen5 storage tailored for edge applications. Coinciding with their 30th anniversary and the FIFA World Cup preparations, Lexar unveiled co-branded PSSD/USB drives featuring the Argentina National Football Team, emphasizing their commitment to creating dynamic edge AI solutions.

A Look Toward the Future

As Longsys advances into the future of technology, the company aims to leverage its comprehensive storage manufacturing capabilities to foster the next generation of edge AI storage solutions. With a heritage of innovation dating back to 1999, Longsys continues to emerge as a leader in the semiconductor memory sector, committed to addressing the growing needs of AI-driven industries around the globe.

For more information about Longsys and their groundbreaking products, visit Longsys or follow them on their social media platforms.