#Japan #Nagoya #Thermalnite #U-MAP #Hybrid Filler

U-MAP's Groundbreaking Thermal Network Design

U-MAP, based in Nagoya, Japan, is on the verge of transforming thermal management within electronic devices through its innovative approach to thermal materials. As the demand for efficient heat dissipation in electric vehicles (EVs), AI semiconductors, and power devices grows, U-MAP is set to introduce its revolutionary thermal network design concept at the upcoming TECHNO-FRONTIER 2026 exhibition.

Background: Addressing a Structural Paradox

The increasing power outputs of modern technologies create mounting pressures on thermal materials. Traditionally, thermal engineers have increased the thermal conductivity of materials by adding spherical fillers. However, this method inadvertently raises resin viscosity, which can compromise moldability and mechanical strength, resulting in a significant structural contradiction.

U-MAP aims to challenge this status quo with its unique Thermalnite® fiber-based aluminum nitride (AlN) crystal filler, a one-of-a-kind product that enables a novel approach to thermal design. Instead of focusing solely on enhancing filler content, the company emphasizes designing pathways for heat to escape effectively, fundamentally reshaping heat management strategies.

A Year-Long Commitment to Innovation

Starting with TECHNO-FRONTIER 2026, U-MAP plans to participate in four major exhibitions throughout the fiscal year, showcasing its advanced thermal design techniques and expanding connections with engineers and material developers. This strategic outreach will highlight the benefits of their hybrid fillers, which combine fiber and spherical AlN to form continuous thermal conductive pathways with low filler content.

Highlight: TECHNO-FRONTIER 2026

Set to take place from July 15 to 17, U-MAP's booth will exhibit a range of products and technologies, including:

• - Hybrid Fillers: Demonstrating how fibers bridge gaps between spherical particles to allow for effective thermal paths, with types ranging from large particles (up to 15 W/m·K) to small particles (4.6 W/m·K) and fine particles currently in development.
• - TIM Sheets: High thermal conductive sheets (12.5 W/m·K) and low thermal resistance sheets (in development), with case studies for power modules and optical communication devices on display.
• - High-Strength AlN Substrates: In collaboration with Okamoto Glass Co., these substrates possess thermal conductivities ranging from 170 to 230 W/m·K, with a double increase in fracture toughness due to Thermalnite® incorporation, now certified for mass production.

Seminar at TECHNO-FRONTIER 2026

On July 16, U-MAP will host a seminar led by Kenji Nishitani, the company's CEO, titled "How the World's Only Fiber-Based AlN Single Crystal Filler, Thermalnite®, is Shaping Next-Generation Thermal Material Design." The 50-minute presentation will address the paradigm shift from increasing filler content to designing heat escape routes, supported by robust technical evidence of their hybrid filler technology. Given limited seating, pre-registration is highly recommended.

Registration and Exhibition Details

• - Exhibition Name: TECHNO-FRONTIER 2026 | Thermal Design and Countermeasure Technology Exhibition
• - Dates: July 15-17, 2026, from 9:30 AM to 5:00 PM
• - Location: Tokyo Big Sight, West Exhibition Hall
• - Booth Number: 3-F21
• - Collaborating Company: Okamoto Glass Co.
• - Entry Fee: Free (pre-registration required)
• - More Information: U-MAP TECHNO-FRONTIER Link

About U-MAP

Founded in December 2016, U-MAP is a trailblazer in the material startup arena, originating from Nagoya University. The company’s proprietary technology for manufacturing the exceptional Thermalnite® filler positions it uniquely in the market, tackling thermal challenges in the EV, power device, and AI semiconductor sectors. With over 300 business discussions and 150 sample evaluations already completed, U-MAP holds ISO 9001 and 14001 certifications and has applied for over 20 patents. Mass production of Thermalnite® has commenced.

For further inquiries, please contact our Business Development and PR Marketing team at U-MAP.