#Singapore #E&R Engineering #SEMICON SEA #laser solutions

E&R Engineering Showcases Innovations at SEMICON SEA 2025

E&R Engineering Corp., a leader in the semiconductor industry, is excited to announce its participation in the highly anticipated SEMICON Southeast Asia 2025. This notable event will take place at the Sands Expo & Convention Centre, Singapore, from May 20-22, 2025. With a dedication spanning over three decades, E&R is set to unveil cutting-edge innovations in advanced laser and plasma processing. The company aims to push the boundaries of semiconductor equipment technology with its new offerings.

In a strategic move, E&R will collaborate with two formidable partners, Zen Voce and GP Group, to form a powerful joint exhibition team. Each company contributes significant experience in various sectors of the semiconductor industry, ranging from front-end and packaging to back-end automation. This collaboration highlights a shared commitment to innovation and quality, encapsulating the belief that "1 + 1 + 1 > 3"—where the combined strength creates more value than individual efforts.

Highlighted Technologies

E&R Engineering will feature several innovative technologies at the event:

Plasma Dicing

• - Hybride Solution for Dicing: E&R presents a hybrid solution that integrates laser grooving with plasma dicing, effectively supporting ultra-fine die sizes from 10 to 30 microns. In addition to equipment, E&R also offers a turnkey service capable of processing unique shapes like hexagons, circles, or modified partial reflows with unparalleled precision and consistency.

Fan-Out Panel Level Packaging (FOPLP)

• - Comprehensive Solution: The E&R system supports large panel processes up to 700x700 mm, including laser marking, cutting, plasma cleaning, and post-drilling de-smearing, with remarkable distortion control up to 16 mm. The process is complemented by advanced laser debonding and plasma dry etching solutions to separate the glass carrier from the panel effectively.

Glass Substrate Solutions

• - Leading Glass Core Processes: E&R excels in high-productivity TGV drilling (600–1,000 VPS, ±5 μm at 3σ) and laser polishing of glass to control sidewall roughness. Moreover, they implement laser bevel cutting and precision automatic optical inspection (AOI) for fault detection.

Advanced Packaging

• - High-Precision Laser Drilling: E&R offers precision laser drilling solutions for 2.5D and 3D integrated circuits, achieving ±5 μm accuracy and a B/T ratio of up to 90%. The combination of hybrid laser and plasma technologies delivers modern Through-Silicon Via (TSV) solutions, while multi-beam laser marking ensures accuracy within ±25 μm, enhancing throughput significantly. Controlled thermal laser cutting is also part of E&R's comprehensive offerings.

As the semiconductor industry strides toward efficiency and integration, the collaboration between E&R Engineering, Zen Voce, and GP Group is set to redefine the future of semiconductor manufacturing at SEMICON SEA 2025. Join us at Booth #L2413 at the Sands Expo & Convention Centre to explore how we are revolutionizing semiconductor technology through innovative, precise, and integrated solutions.

Booth Information:

• - Number: #L2413
• - Location: Sands Expo & Convention Centre, Singapore
• - Dates: May 20-22, 2025
• - Website: E&R Engineering