#China #Shenzhen #5G Technology #JarnisTech #Hybrid Lamination

JarnisTech's Breakthrough in 5G Hardware Manufacturing

In a significant advancement for the telecommunications sector, JarnisTech has successfully validated its innovative Hybrid Lamination Process. This cutting-edge technique is designed to drastically reduce the Bill of Materials (BOM) costs for 5G hardware, particularly for antenna modules and base stations, by approximately 30-40% without compromising on radio frequency (RF) performance.

Overview of the Hybrid Lamination Process

JarnisTech, a leading provider in PCB manufacturing and assembly, has traditionally faced challenges in integrating high-frequency materials with widely used substrates like FR-4. The Hybrid Lamination approach allows for the integration of advanced materials such as Rogers or Taconic with standard substrates, enabling the creation of multilayer boards that can sustain the demanding performance standards of 5G infrastructure.

Cost Optimization

The essence of JarnisTech’s solution lies in its ability to optimize the use of costly high-speed laminates. This optimization not only helps to decrease production costs but also ensures that critical RF signal layers utilize these expensive materials effectively. Meanwhile, more economical FR-4 substrates can be employed for less critical layers involving power, ground, and digital controls. The result is a smarter allocation of resources that enhances cost-efficiency in manufacturing processes.

Overcoming Technical Hurdles

One of the major technical challenges in hybrid PCB manufacturing has been the mismatch in the Coefficient of Thermal Expansion (CTE) between low-loss materials and standard FR-4 substrates. To tackle this issue, JarnisTech has developed a proprietary method called Dynamic Pressure Profiling. This innovative technique allows the precise control of thermal ramp-up rates and pressure dwell times during the curing process, helping to mitigate common defects like delamination and registration shifts, which can jeopardize the quality of assembled boards.

Key Technical Innovations

Several critical innovations have driven the success of JarnisTech's hybrid process:

• - Enhanced Adhesion: By implementing plasma surface treatments, JarnisTech activates the inert surface of PTFE materials prior to bonding, ensuring greater structural integrity under thermal stress.
• - Advanced Layer Alignment: Non-linear scaling compensation is employed to achieve high-precision layer-to-layer registration, which is essential for the high-density interconnects necessary in 5G active antenna units (AAUs).
• - Signal Integrity Assurance: The company has verified that impedance control tolerances on hybrid interfaces remain within ±8%, which minimizes insertion loss during material transitions.

Competitive Advantage for Telecom Manufacturers

With the ongoing rollout of 5G technology, manufacturers are increasingly recognizing the value of JarnisTech’s hybrid approach. By enabling telecom Original Equipment Manufacturers (OEMs) to effectively manage their material costs, the Hybrid Lamination Process not only enhances competitive pricing but also promotes better design flexibility. Designers can now focus on using high-performance materials only where necessary, reducing waste and maintaining the integrity of essential RF capabilities.

JarnisTech is now open to technical inquiries regarding hybrid design reviews. The company also offers complimentary Design for Manufacturing (DFM) analysis to assist clients in transitioning fully to hybrid designs, optimizing for both performance and cost.

A History of Innovation

Founded in 2002, JarnisTech has established itself as one of China’s premier PCB manufacturers. With over two decades of expertise in developing and manufacturing custom printed circuit boards, the company provides a wide range of services, including rapid prototyping, assembly, and component sourcing. Their commitment to quality and cost-effectiveness sets them apart in a competitive landscape.

For further information on JarnisTech’s Hybrid Lamination Process and its impact on the 5G market, please visit www.jarnistech.com.