Yield Engineering Systems Launches Advanced VertaCure XP G3 Polymerization System

YES Launches VertaCure XP G3 for Advanced Packaging Solutions

Yield Engineering Systems, Inc. (YES), a leader in manufacturing advanced processing equipment for semiconductor solutions in AI and high-performance computing, has officially unveiled its latest innovation: the VertaCure XP G3 systems. This latest generation of polymerization systems is set to revolutionize the manufacturing of advanced packaging solutions for cutting-edge applications in artificial intelligence and intensive computing environments.

The VertaCure XP G3 systems will play a critical role in the low-temperature curing of multiple layers of RDL (Redistribution Layer) used in 2.5D and 3D packaging formats. This state-of-the-art tool architecture can also be optimized for high-throughput hybrid adhesive curing solutions, representing a significant leap in technology for manufacturers.

In the competitive landscape of semiconductor production, YES is known for its exceptional quality assurance in curing, coating, and annealing processes, and the VertaCure series maintains this legacy, combining cutting-edge technology with practical manufacturing needs.

The VertaCure XP G3 offers a fully automated 6-zone vacuum polymerization system that guarantees complete removal of residual solvents, uniform temperature distribution, and precise management of heating and cooling rates. These features not only ensure top-notch production quality but also address critical performance issues, including excellent particle control and gas release management after polymerization.

With an impressive thermal uniformity of ± 1°C above 200°C during hold and ramp phases, the system is crucial for high-performance polyimide curing of thick films. This makes it an invaluable asset in meeting the stringent requirements of the semiconductor packaging sector.

"The VertaCure system has been a proven automatic vacuum polymerization solution in production, delivering superior film properties and significantly higher yields than traditional atmospheric curing methods. Its six-zone temperature control system provides excellent uniformity and performance required for curing polyimide, PBO, and epoxy materials. It also ensures higher mechanical, thermal, and electrical properties for a wide range of polymers used in wafer-level packaging (WLP), critical for AI and compute-intensive applications," stated Saket Chadda, Senior Vice President at YES.

YES's Executive Vice President for Business Development and Marketing, Alex Chow, emphasized the relevance of the VertaCure product line, asserting that it provides a controlled, reproducible, and scalable manufacturing process ideal for Wafer-to-Wafer and Die-to-Wafer bonding applications. "This system offers superior quality and a compelling total cost of ownership, especially for advanced packaging solutions in the semiconductor industry. This product strongly solidifies our leadership position in the polymerization tool market," he added.

About Yield Engineering Systems (YES)

YES stands at the forefront of differentiated technologies for material and interface engineering necessary for a wide array of applications across various markets. Its clientele comprises market leaders advancing next-generation solutions across diverse sectors, including advanced packaging for AI and intensive computing, memory systems, and life sciences.

As a prominent manufacturer of cutting-edge, cost-effective, high-volume production equipment for semiconductor advanced packaging solutions, YES develops vacuum polymerization tools, coating and annealing solutions, flux-less reflow systems, glass etching tools, and electrolytic deposition systems specifically for the semiconductor industry. Based in Fremont, California, YES is rapidly increasing its global footprint while continuing to uphold excellence in technology and manufacturing practices.

For more information, please visit YES.tech.