#Spain #Barcelona #IDEMIA #Acceleronix #Tele2 IoT

Acceleronix and IDEMIA Launch IFPP Early Access Program

At the Mobile World Congress Barcelona 2026, Acceleronix, a prominent name in IoT technologies, in collaboration with IDEMIA Secure Transactions and Tele2 IoT, announced the launch of the In-Factory Profile Provisioning (IFPP) Early Access Program. This cutting-edge initiative aims to revolutionize IoT device manufacturing, allowing Original Equipment Manufacturers (OEMs) to preload connectivity profiles directly onto eSIMs during the device production process.

What is the IFPP Early Access Program?

The IFPP Early Access Program offers participants a unique opportunity to implement a quantum-safe solution for IoT connectivity. The essence of the program lies in its capability to streamline the IoT lifecycle by ensuring devices are ready for connectivity the moment they leave the factory floor. Utilizing just one single eSIM part number (1 SKU), manufacturers can simplify their processes significantly, which is particularly beneficial for operations ranging from small scale to large factories.

The program’s features extend to automated provisioning, real-time monitoring, and comprehensive traceability, all of which lead to improved SKU management and expedited time-to-market. By integrating high-level cryptographic standards, it ensures the secure handling of connectivity profiles even in offline or air-gapped environments, making it an attractive option for OEMs looking to mitigate operational risks. Moreover, the program is designed to be compatible with upcoming GSMA specifications, including SGP.42, thereby scaling effortlessly for substantial IoT deployments.

Key Highlights of the Collaboration

Gal Olshinka, Director at Acceleronix, emphasized the significance of the IFPP Early Access Program during the launch, stating, "Our commitment to eSIM technology and the streamlining of the IoT device and connectivity lifecycle is evident in this initiative. Partnering with IDEMIA and Tele2 IoT allows us to showcase how IFPP can facilitate out-of-the-box connectivity, drastically reducing operational complexities."

Philippe De Oliveira, Senior VP of Auto/IoT Connectivity Services at IDEMIA, echoed this sentiment, declaring that the IFPP represents a pivotal moment for OEMs seeking to optimize their manufacturing process for connected devices. He elaborated on how merging expertise in eSIM solutions and quantum-safe technology demonstrates the practicality and live capability of in-factory provisioning.

Onur Kasaba, Managing Director of Tele2 IoT, expressed pride in the collaboration, noting the program’s potential to reduce complexity and foster expansive, secure IoT deployments. The combination of Tele2’s managed global IoT connectivity with in-factory provisioning promises a seamless transition for devices ready to connect immediately upon leaving the production line.

Live Demonstrations at MWC26

Attendees at MWC Barcelona can experience the IFPP in action firsthand. The Acceleronix booth will host live demonstrations, showcasing how IFPP simplifies the production process for manufacturers. OEMs interested in joining the IFPP Early Access Program will be given a trial kit and the chance to be among the first to deploy factory-ready, quantum-safe connectivity solutions.

About Acceleronix

Acceleronix positions itself as a trusted partner in IoT solutions, assisting innovators in expediting their journey from concept to global deployment. The company facilitates diverse aspects of IoT, including design, connectivity, SIM/eSIM lifecycle management, AI, and cloud services, ensuring an efficient and streamlined process for clients looking to launch and scale effectively.

For more details regarding the program and to explore opportunities, participants can visit the Acceleronix stand at MWC Barcelona or check their official website for comprehensive insights into their offerings.