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Hyundai Mobis and Qualcomm Join Forces at CES 2026

In an exciting development for the automotive and technology industries, Hyundai Mobis and Qualcomm Technologies Inc. have entered into a comprehensive agreement to collaborate on Software-Defined Vehicle (SDV) architecture and Advanced Driver Assistance Systems (ADAS). This announcement was made during CES 2026 in Las Vegas, signaling a significant step forward in the integration of advanced automotive technologies.

The memorandum of understanding (MOU) was formalized at Hyundai Mobis' exhibition booth, which showcased cutting-edge vehicle technologies. Key figures present at the signing included Jung Soo-Kyung, Executive Vice President and head of the Automotive Electronics Business Unit at Hyundai Mobis, and Nakul Duggal, Executive Vice President and General Manager of Automotive at Qualcomm Technologies.

Strategic Objectives

This partnership aims to develop integrated solutions specifically designed for emerging markets, with a keen focus on enhancing performance, efficiency, and stability for ADAS through the utilization of Qualcomm's Snapdragon Ride Flex system-on-chip (SoC). The collaboration also seeks to tap into broader global supply opportunities, combining Hyundai Mobis's system integration expertise with Qualcomm's cutting-edge semiconductor technology.

Accelerating ADAS Adoption

The initial phase of this collaboration will focus on co-developing advanced driving and parking solutions that leverage Qualcomm’s SoC technology. This is particularly timely given the rising demand for ADAS in dynamic markets like India, where consumer interest in safe, smart automotive solutions is on the rise. The partnership is poised to address this growing need by introducing SDV-ready architectures that meet the expectations of contemporary drivers.

As the automotive landscape evolves, integrating advanced technologies is critical for manufacturers looking to stay competitive. Hyundai Mobis and Qualcomm's initiative not only aligns with industry trends but also positions both companies to lead the charge in innovations that cater to the needs of consumers.

Broader Implications for the Automotive Sector

Beyond the scope of ADAS, the agreement also lays the groundwork for future SDV applications. Both firms will work towards developing next-generation integrated solutions which will combine Hyundai Mobis's standardized software platform with Qualcomm’s Snapdragon automotive technologies. This combined approach promises to yield improvements across various metrics, including vehicle performance and operational stability.

Engagement at CES 2026

During CES 2026, Hyundai Mobis utilized a private exhibition booth to engage with select global clients. This strategy reflects their intention to broaden their order portfolio by venturing into new business realms such as robotics and semiconductor technologies. Over four days, more than 200 representatives from major automotive companies across North America and Europe visited the booth, engaging in detailed discussions about future collaborations.

Conclusion

As automotive technologies continue to converge with advanced computing systems, the collaboration between Hyundai Mobis and Qualcomm marks a crucial milestone. By harnessing synergies between their respective expertise, both companies are poised to make significant contributions towards the future of automotive technologies, particularly in the realm of SDVs and ADAS. This partnership exemplifies how innovation and collaboration can pave the way for enhanced vehicle safety and performance, ultimately transforming driver experiences across the globe.