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Molex Unveils Multi-Channel Liquid Cooled Busbar at Computex 2026

Molex, renowned for its advancements in electronics and connectivity, is set to reveal a groundbreaking thermal management solution at Computex 2026. The company's latest offering, the Multi-Channel Liquid Cooled Busbar, is designed to meet the increasing power requirements of AI data centers, which are rapidly approaching the 1-megawatt (MW) threshold.

Addressing Thermal Limits

As data centers evolve with more intensive AI workloads, traditional air cooling methods face significant limitations. Recognizing this challenge, Molex has developed a solution that integrates liquid cooling directly into the power-distribution layer. This innovative approach not only caters to current demands, supporting electrical currents up to 15,000 Amps, but is also poised for future requirements as it paves the way towards 25,000 Amps.

Kevin Alberts, VP, and GM of Molex's Power and Signal Business Unit, emphasized the necessity of tackling the thermal challenges associated with power paths in AI infrastructures. He stated, “Direct-to-chip cooling is now standard for compute, but for AI to truly scale, we must also address the thermal challenges of the power path.” With these new busbars, Molex aims to ensure that customers can achieve stable electrical performance and minimize thermal stress without expanding the physical size of their racks.

The Multi-Channel Architecture

What sets Molex's Multi-Channel Liquid Cooled Busbars apart is their unique architecture. Unlike conventional designs that utilize a single-channel fluid path, Molex employs a multi-channel system featuring up to seven individual coolant channels. This design enhances heat extraction, significantly reducing the occurrence of hot spots while maintaining consistent electrical performance, especially crucial when operating at high currents.

Data simulations conducted by Molex demonstrate that this seven-channel architecture can increase cooling efficiency by up to 20% compared to traditional single-channel designs. This efficiency means that data center architects can deliver higher power outputs without compromising valuable space in their setups.

Customization and Future-Proofing

The new busbars are engineered for remarkable configurability, giving customers the flexibility to customize their length, depth, and fluid connections to suit specific layouts. With an easy plug-and-play design, transitioning to these liquid cooling solutions becomes seamless, eliminating the need for major rack redesigns.

Additionally, the busbars maintain compatibility with ORV3 and HPR mechanical standards, simplifying integration processes and enhancing reliability in data centers. This is particularly advantageous for larger hyperscale operations that may pre-install high-capacity power infrastructure for long-term use and ease the transition to next-gen systems and more powerful rack configurations.

By ensuring compatibility with both dielectric and non-dielectric cooling liquids, these solutions can be easily adapted into existing cooling loops in various facilities, maintaining investment security as operational demands evolve over time.

Showcasing Innovations at Computex 2026

At Computex 2026, attendees can expect to see a live demonstration showcasing the real-time thermal mapping capabilities of these Multi-Channel Liquid Cooled Busbars, particularly under the demanding conditions typical of high-density AI workloads. Molex will also unveil other innovative technologies aimed at fostering next-generation AI infrastructure:

• - Integrated Rack Solutions: Advanced cooling innovations designed to optimize energy consumption and alleviate thermal constraints.
• - 448G High-Speed Connectivity: Innovations that facilitate next-gen data transmission within AI servers.
• - CPO, CPC, and XPO Connectivity Portfolio: Co-packaged and optical solutions that support scalable architectures for higher interconnect density, minimizing power loss and boosting performance.
• - Cutting-Edge Optical Solutions: Fiber connectivity innovations from Teramount, a recent Molex acquisition, aimed at enhancing high-density optical infrastructure.

Conclusion

Molex continues to push the boundaries of thermal management in the electronics industry. With its Multi-Channel Liquid Cooled Busbars and other upcoming technologies, the company is ideally positioned to support the burgeoning needs of AI data centers, ensuring they can scale effectively while maintaining operational stability. Discover more about these innovations by visiting Molex’s booth at Computex 2026 and witness firsthand the future of data center thermal management.

For further information about the company and its offerings, visit Molex.