Longsys Introduces Cutting-Edge AI Storage Solutions at FMS 2026 Event

Longsys Showcases Cutting-Edge AI Storage Solutions at FMS 2026

Longsys, a renowned semiconductor memory enterprise, recently unveiled its exciting innovations at the Future of Memory and Storage (FMS) 2026, held in San Jose, California. Under the banner of 'Edge AI Storage Fusion', the company highlighted three primary applications: AI Agent Hosts, AI PCs, and AI Mobile devices. In collaboration with AMD, Longsys is tackling existing challenges like memory bottlenecks, latency, and cache expansion in local large language model (LLM) deployments.

Advanced Technologies for Enhanced Performance

One of the most notable features presented was the AIDIMM™ high-bandwidth memory, which seamlessly integrates with the Intelligent Storage Agent (iSA™) and AISSD™ solutions. A live demonstration showcased an impressive performance using just 64GB of AIDIMM™ memory to run models with 70B, 80B, and 122B parameters smoothly. This efficiency shows a significant reduction in memory usage while enhancing inference capabilities.

Additionally, Longsys introduced the AMD Ryzen™ AI Halo platform, which is now integrated with AISSD™ and iSA™ technologies, and has received AMD AVL certification. This makes it ready for mass deployment, marking a significant step towards scalable AI solutions.

Innovations in AI PC Storage

In the realm of AI PCs, Longsys presented its 5nm SPU™ (Storage Processing Unit), which powers a DRAM-less PCIe Gen5 SSD. This high-performance SSD achieves remarkable sequential read speeds of 14.8 GB/s and write speeds of 13 GB/s, all while operating at a mere 6.3 watts—about 10% lower than competing solutions. With built-in lossless compression that can expand usable capacity significantly, Longsys is set to revolutionize how storage is approached in AI applications.

Their PCIe Gen5 mSSD variant also boasts impressive specs with read speeds of 11 GB/s and write speeds of up to 10 GB/s, along with compatibility for various form factors, which allows for flexibility in manufacturing processes. Longsys's production capacity exceeds one million units monthly, catering to partnerships with major brands like Lenovo and ASUS.

Mobile Solutions for Intelligent Devices

Longsys isn’t just focused on PCs; their innovations extend to mobile technologies as well. The introduction of HLCache™ UFS technology demonstrates how cold data can be intelligently offloaded from DRAM to storage. Testing on devices such as the Google Pixel 7a revealed a 64% increase in background app capacity and a notable reduction in DRAM usage. This feature not only enhances device performance but also extends battery life in mobile devices where power efficiency is crucial.

They also showcased the AILPBGA™, a compact 22×22mm embedded memory solution, which offers a 256-bit interface and a peak bandwidth of 307GB/s—ideal for power-constrained mobile implementations.

Global Strategy and Future Directions

Longsys operates with a multi-brand approach that includes their consumer brand Lexar and a manufacturing hub in South America, namely Zilia. This strategy not only supports localized production but also aims to enhance delivery and technical assistance for customers around the globe. Looking forward, the company plans to continue advancing its proprietary technologies while collaborating with global partners to push the boundaries of Edge AI storage solutions.

Founded in 1999, Longsys has quickly established itself as a leading entity in the semiconductor memory space, seamlessly combining R&D, design, packaging, testing, manufacturing, and sales. For more information about their innovative products and solutions, you can visit their official website or connect with them on social platforms like LinkedIn and Facebook.