#South Korea #Metrology #Semiconductor #Park Systems #Gwacheon

Park Systems' Innovative Approach to Metrology in Semiconductor Manufacturing

In a significant advancement for semiconductor research and production, Park Systems, a renowned leader in atomic force microscopy (AFM) and nanoscale metrology, announced the launch of a new Joint Development Program (JDP). This initiative focuses on enhancing metrology solutions specifically tailored for 3D packaging and next-generation logic research.

Park Systems is positioned at the forefront of technologies that bridge the gap between complex semiconductor architectures and effective measurement solutions. The company's expansive product portfolio will play a key role in the JDP, integrating solutions such as AFM, white-light interferometry (WLI), imaging spectroscopic ellipsometry (ISE), and digital holographic microscopy (DHM). Each of these technologies is crucial for understanding and optimizing the intricate details of semiconductor fabrication processes.

The collaboration is set to take place at imec, a leading global research and innovation hub for advanced semiconductor technology located in Belgium. imec is known for its cutting-edge facilities aimed at cultivating an ecosystem for semiconductor technology development, scaling from early research to commercially viable solutions. Imec will provide critical patterns based on roadmaps for advanced 3D packaging and logic, reflecting the growing demands and complexities of semiconductor manufacturing.

Dr. Sang-il Park, founder and CEO of Park Systems, remarked on the escalating intricacies in semiconductor fabrication, emphasizing, "The semiconductor manufacturing landscape has entered a new era of complexity, demanding sophisticated metrology solutions to ensure successful outcomes." He noted that their collaboration with imec aims to address these challenges effectively, leveraging Park Systems' latest innovations.

The JDP is not just a mere partnership; it also grants access to imec's Industrial Affiliation Program (IIAP) focused on 3D systems integration, highlighting a shared commitment to solving the industry's most pressing measurement challenges over the next two years.

As Park Systems embarks on this initiative, it coincides with the inauguration of its new global headquarters in Gwacheon, South Korea. This facility is designed to enhance the company's research and development capabilities, allowing for further exploration and innovation in measurement technologies suitable for the semiconductor sector. Philippe Leray, head of patterning research and development at imec, commented, "Future semiconductor architectures and materials present significant challenges for component integration, and this is particularly true for metrology. Our collaboration with Park Systems aims to demonstrate how their advanced capabilities can enable the future roadmap of semiconductor technologies."

Park Systems' expertise isn't solely tied to enabling 3D packaging; it expands across various applications, bolstering efforts in semiconductor manufacturing, materials science, and nanotechnology research. Established by Dr. Sang-il Park, who played a pivotal role in the invention of AFM at Stanford University, the company continues to evolve and lead in the global nanoscale metrology industry through persistent innovation and strategic growth.

For those looking to learn more about Park Systems and its groundbreaking technologies, a wealth of information is available at www.parksystems.com. By continuously pushing the boundaries of metrology, Park Systems is not only shaping the future of semiconductor technology but also setting new standards in the precision measurement landscape.