#United States #Hudson #Diamond Technologies #OEM Solutions #Embedded Computing

Diamond Technologies Inc. Expands Embedded Computing Portfolio

Diamond Technologies, Inc. (DTI), a prominent name in embedded solutions for OEMs, has recently announced the launch of three new computing modules: the DEC i.MX 91-OSM, DEC i.MX 93-OSM, and DEC MP2-OSM. These modules are expected to significantly enhance the performance and functionality of embedded systems in various applications.

Advancements in Embedded Computing

The new modules feature advanced processing capabilities, secure connectivity, and efficient edge computing options. They are designed to alleviate the complexities often involved in embedded development, catering to the growing demands of the market.

"We are thrilled to introduce these modules as part of our expansive product line," stated Paul Tesini, President of Diamond Technologies. "Our aim is to provide OEMs with versatile and powerful solutions that simplify their design processes and expedite time to market."

Technical Specifications

The DEC i.MX 91-OSM and DEC i.MX 93-OSM modules are powered by the NXP i.MX 91 and 93 processors, respectively. These processors facilitate efficient AI and machine learning acceleration for devices that require intelligent processing capabilities. Here are some key highlights of these modules:

• - DEC i.MX 91-OSM:

- Utilizes a single Arm® Cortex®-A55 core for optimal performance
- Features an integrated Arm® Cortex®-M33 for real-time control
- Supports up to 2GB of 16-bit LPDDR4X memory
- Broad I/O support including Ethernet, USB, UART, SPI, and I²C
- Ideal for low-power, fanless systems

• - DEC i.MX 93-OSM:

- Equipped with dual Arm® Cortex®-A55 cores along with a Cortex®-M33
- Built-in Arm® Cortex®-M33 enhances secure real-time processing
- Integrates Ethos™-U65 NPU for AI and ML acceleration

The DEC MP2-OSM, based on the STMicroelectronics STM32MP2 processor, also plays a crucial role in bolstering connectivity and secure processing capabilities, particularly for industrial applications and control systems. Its highlights include:

• - Dual-core Arm® Cortex®-A35
• - Integrated Arm® Cortex®-M33 co-processor
• - On-chip NPU providing up to 1.35 TOPS for AI/ML tasks
• - Multiple connectivity options like Ethernet, USB 2.0/3.0, SD/MMC, CAN-FD, and UART
• - Specially optimized for low-power operation

These modules carry an industry-standard OSM form factor, which means they are designed for quick adoption and scalability in future deployments.

A Competitive Edge

By incorporating these new modules into its product suite, DTI not only strengthens its position in the market, but also empowers its customers to achieve their project goals effectively. The focus is on reducing design complexity and giving OEMs the tools they need to develop innovative solutions efficiently.

DTI is dedicated to ensuring that their customers receive the best possible support throughout their project lifecycles, including assistance with design, installation, and long-term support. This commitment is reinforced by DTI’s extensive engineering resources, which are vital for managing lifecycle and obsolescence issues.

Looking Ahead

As part of the discoverIE Group plc, Diamond Technologies, Inc. has been at the forefront of providing high-performance, reliable embedded solutions since 1997. Their collaboration with industry leaders enables them to continue delivering cutting-edge innovations designed to meet the evolving needs of their clients across a variety of sectors.

For more detailed specifications and product briefs for the new embedded computing modules, visit www.diamondt.com.

Final Thoughts

DTI's new offerings highlight a crucial shift towards enhancing embedded computing capabilities and the importance of agility in the designs of embedded systems. As the technological landscape evolves, companies like Diamond Technologies provide essential resources and support to help OEMs innovate and stay competitive.