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Acroname Launches USBExt3c – A Professional USB3.2 Extension Solution

Acroname, part of Valens Semiconductor, has unveiled its latest innovation: the USBExt3c. This 3-port switchable hub is designed to redefine USB connectivity in various industries, particularly in audiovisual installations and original equipment manufacturing (OEM).

Enhancing USB Connectivity

The USBExt3c is not just another USB hub; it's a state-of-the-art device that combines the capabilities of USB3 and USB2 extensions along with advanced Power over Ethernet (PoE) and USB-C power delivery. This product specifically caters to audio-visual installers and OEM manufacturers by providing seamless control and management of USB devices, significantly improving the efficiency of product deployment across sectors like corporate, educational, and machine vision applications.

One of the notable features of the USBExt3c is its ability to facilitate point-to-point connections. This means that the hub can effectively bypass the traditional limitations imposed by short USB cable lengths. This breakthrough in technology allows for the extension of USB devices well beyond what was previously possible, ensuring users can operate high-bandwidth peripherals without concerns about power negotiation issues.

Solving Power Delivery Challenges

A critical aspect of the USBExt3c is its incorporation of Valens' HDBaseT technology along with Acroname's BrainStem system automation control platform. This synergy addresses the complex challenges associated with power delivery and negotiation in USB-extended systems. The result is a robust solution for high-demand devices, such as advanced cameras and storage systems, which require significant power during operation. This capability includes the support needed for high-power charging applications, like laptops, which adds to the flexibility of its deployment.

Professional-Grade Reliability

"This product launch signifies a remarkable advancement in the realm of professional-grade USB technologies," remarked Justin Gregg, the CEO of Acroname. He emphasized that the USBExt3c empowers users by providing unprecedented reliability for USB connections, thereby allowing for more robust and flexible system designs.

The collaboration between Acroname and Valens Semiconductor has paved the way for innovations like the USBExt3c, which is anchored in Acroname's modular and scalable BrainStem platform. This platform, which facilitates the management of USB and USB-PD in OEM applications worldwide, is fundamental to the new product's design.

Industry Launch and Demonstrations

The USBExt3c will make its official debut at the upcoming Integrated Systems Europe (ISE) 2025, taking place from February 4 to 7, 2025. Visitors can experience hands-on demonstrations at the HDBaseT Alliance booth (#2M500). During this event, Acroname will also showcase a suite of advanced USB solutions that enhance system visibility, using notable integrations with platforms like AVI-SPL's Symphony and Sennheiser's TeamConnect Bar products.

For those interested in a deeper look at the USBExt3c, including detailed specifications and visual content, further information is available on Acroname's product page.

About Valens Semiconductor

Valens Semiconductor (NYSE: VLN) stands at the forefront of high-performance connectivity solutions, transforming digital experiences globally. Its chipsets are synonymous with innovation, enabling state-of-the-art audio-visual setups and advancing technologies in autonomous driving and improved next-gen videoconferencing. By continually setting industry standards, Valens ensures cutting-edge performance across its product range. To learn more, visit Valens Semiconductor.