Blue Cheetah Unveils Innovative Chiplet Interconnect IP on Samsung's SF4X Process

In a significant leap for semiconductor technology, Blue Cheetah Analog Design has successfully announced the tape-out of its next-generation die-to-die (D2D) physical layer (PHY) interconnect solution, BlueLynx™, utilizing Samsung Foundry's advanced SF4X 4nm manufacturing process. This technological breakthrough offers a robust throughput exceeding 100 terabits per second (Tbps) while optimizing power consumption and silicon area, key factors in enhancing the efficiency of chiplet-based designs in high-performance computing and networking applications.

Bridging the Future of Chiplet Designs

The BlueLynx™ PHY not only accommodates conventional 2D chiplet configurations but also supports sophisticated 2.5D packaging technologies, allowing system designers to effortlessly adapt packaging techniques for present and upcoming projects. This flexibility is crucial as industry demands for compact, high-speed chip solutions surge, particularly in applications related to artificial intelligence (AI) and machine learning (ML).

As customer deliveries commenced in late 2024, silicon characterization for both advanced and standard packaging solutions is slated for early Q2 2025, marking a pivotal step in ensuring reliable production deployment.

Customizable and Versatile Technology

The versatility of Blue Cheetah's interconnect solutions is evident, catering extensively to AI/ML, high-performance computing, and mobile applications across a range of process nodes. The integration of Universal Chiplet Interconnect Express (UCIe) and the Open Compute Project (OCP) Bunch of Wires (BoW) interfaces showcases the adaptability of the BlueLynx platform. Furthermore, an optional link layer can seamlessly connect various on-die buses and Networks-on-Chip (NoCs) utilizing established standards like AXI4, AXI5 Lite, ACE, and CHI.

Samsung's substantial investment in foundry process technologies geared towards generative AI, in conjunction with Blue Cheetah’s advanced PHY technology, promises to enhance chip design performance significantly, facilitating quicker market entry for developers of chiplet-based components.