BAE Systems Unveils Endura™ Processor with Advanced Radiation-Hardened Capabilities for Space Missions
In a significant advancement for space technology, BAE Systems has successfully demonstrated the remarkable capabilities of its Endura™ system-on-chip (SoC) which is engineered to withstand and operate effectively in the harshest radiation environments found in space. The Endura processor stands out as a robust solution for various space missions where durability and reliability are paramount.
According to Joe Dziezynski, the product line director for BAE Systems' Space Systems division, this achievement positions the Endura processor as one of the leading high-performance processors tailored for the space community. Leveraging BAE Systems' cutting-edge commercial foundry technology, the Endura SoC is distinctively designed to be smaller, consume less power, and be more cost-effective, which is crucial for missions that require high levels of survivability in extreme radiation conditions.
The development of the Endura SoC was based on BAE's innovative radiation-hardened 45 nanometer (RH45 nm) technology. This technology builds upon GlobalFoundries' commercial 45nm silicon-on-insulator platform, with secure manufacturing capabilities rooted in GlobalFoundries' facility in Malta, New York. The RH45® technology integrates a comprehensive library of advanced, commercially licensed features, fostering proven methodologies for designing and manufacturing application-specific integrated circuits (ASICs). The successful strategic radiation-hardened testing not only enhances the Endura SoC but also signals an increase in the survivability of various elements within space systems, including single board computers (SBCs).
Ezra Hall, the Senior Director of Aerospace and Defense at GlobalFoundries, highlighted the importance of their New York facility as a cornerstone for trusted U.S. semiconductor manufacturing. He emphasized that by collaborating with the U.S. government, both GlobalFoundries and BAE Systems are equipped to extend advanced manufacturing and technology solutions to meet the evolving demands for resilient, reliable, and scalable microelectronics critical for aerospace and defense applications.
The Endura processor is set to be integrated into BAE Systems' next-generation Endura product line, which will offer functionalities such as general-purpose processing, networking capabilities, and secure boot options. This product line is geared towards providing high performance with integrated Level 1 and 2 caching along with advanced FPGA components that enable mission-specific acceleration and hardware-accelerated input/output. This integration aims to yield exponential improvements regarding size, speed, power consumption, and overall processing efficiency.
As a platform-agnostic supplier, BAE Systems continues to develop and manufacture high-reliability space electronics, ranging from standard components and single board computers to complete system payloads. The company pledges to provide solutions that cater to High Reliability Class A missions and Class C/D missions, balancing affordability with rigorous assurance requirements. Currently, BAE Systems welcomes orders for its Software Development Units featuring the Endura SoC, ensuring rapid delivery to meet client demands. The production is managed by the company's esteemed Space Systems group located in Manassas, Virginia, a facility recognized as a U.S. Department of War Category 1A Microelectronics Trusted Source, covering a diverse range of services inclusive of design, packaging, assembly, and testing.
For further insights into BAE Systems' innovative journey and to explore potential partnerships or inquiries regarding the Endura processor and its applications, please reach out to Paul Roberts, who can be contacted directly via mobile at 603-521-2381 or through email at [email protected] Visit BAE Systems' official website at www.baesystems.com/US for additional details. As they continue to forge ahead, BAE Systems exemplifies a commitment to advancing high-technology solutions for the future of space exploration.
According to Joe Dziezynski, the product line director for BAE Systems' Space Systems division, this achievement positions the Endura processor as one of the leading high-performance processors tailored for the space community. Leveraging BAE Systems' cutting-edge commercial foundry technology, the Endura SoC is distinctively designed to be smaller, consume less power, and be more cost-effective, which is crucial for missions that require high levels of survivability in extreme radiation conditions.
The development of the Endura SoC was based on BAE's innovative radiation-hardened 45 nanometer (RH45 nm) technology. This technology builds upon GlobalFoundries' commercial 45nm silicon-on-insulator platform, with secure manufacturing capabilities rooted in GlobalFoundries' facility in Malta, New York. The RH45® technology integrates a comprehensive library of advanced, commercially licensed features, fostering proven methodologies for designing and manufacturing application-specific integrated circuits (ASICs). The successful strategic radiation-hardened testing not only enhances the Endura SoC but also signals an increase in the survivability of various elements within space systems, including single board computers (SBCs).
Ezra Hall, the Senior Director of Aerospace and Defense at GlobalFoundries, highlighted the importance of their New York facility as a cornerstone for trusted U.S. semiconductor manufacturing. He emphasized that by collaborating with the U.S. government, both GlobalFoundries and BAE Systems are equipped to extend advanced manufacturing and technology solutions to meet the evolving demands for resilient, reliable, and scalable microelectronics critical for aerospace and defense applications.
The Endura processor is set to be integrated into BAE Systems' next-generation Endura product line, which will offer functionalities such as general-purpose processing, networking capabilities, and secure boot options. This product line is geared towards providing high performance with integrated Level 1 and 2 caching along with advanced FPGA components that enable mission-specific acceleration and hardware-accelerated input/output. This integration aims to yield exponential improvements regarding size, speed, power consumption, and overall processing efficiency.
As a platform-agnostic supplier, BAE Systems continues to develop and manufacture high-reliability space electronics, ranging from standard components and single board computers to complete system payloads. The company pledges to provide solutions that cater to High Reliability Class A missions and Class C/D missions, balancing affordability with rigorous assurance requirements. Currently, BAE Systems welcomes orders for its Software Development Units featuring the Endura SoC, ensuring rapid delivery to meet client demands. The production is managed by the company's esteemed Space Systems group located in Manassas, Virginia, a facility recognized as a U.S. Department of War Category 1A Microelectronics Trusted Source, covering a diverse range of services inclusive of design, packaging, assembly, and testing.
For further insights into BAE Systems' innovative journey and to explore potential partnerships or inquiries regarding the Endura processor and its applications, please reach out to Paul Roberts, who can be contacted directly via mobile at 603-521-2381 or through email at [email protected] Visit BAE Systems' official website at www.baesystems.com/US for additional details. As they continue to forge ahead, BAE Systems exemplifies a commitment to advancing high-technology solutions for the future of space exploration.
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