SEMIFIVE Reveals Pioneering Solutions for AI Semiconductors at SAFE Forum 2026

SEMIFIVE Unveils Advanced Solutions for AI Semiconductors at SAFE Forum 2026

SAN JOSE, California, May 28, 2026 - SEMIFIVE, a prominent innovator in custom artificial intelligence semiconductor solutions, proudly announces its participation in the Samsung Advanced Foundry Ecosystem (SAFE™) Forum 2026. The event, held in San Jose, showcases cutting-edge advancements designed to meet the increasing demands of the AI industry.

During the forum, SEMIFIVE's CEO and co-founder, Brandon Cho, is set to present a critical talk titled "Leading 3D-IC/Big Die Solution for AI Innovation." The presentation will detail SEMIFIVE's extensive expertise in AI design and high-performance computing (HPC), emphasizing innovative breakthroughs that are pivotal for the global market.

Addressing the 'Memory Wall' in AI Development

As AI technologies evolve, they generate a vast amount of processed data, leading to the emergence of significant challenges such as the 'Memory Wall'—the bottleneck between computing devices and memory systems. SEMIFIVE tackles this issue head-on with its pioneering 3-dimensional integrated circuit (3D-IC) ASIC design solutions.

Unlike traditional methods that horizontally link stacked memory to logic chips, SEMIFIVE employs a vertically integrated approach, combining logic and memory within a single system architecture. This innovative design significantly reduces data transmission distances. Compared to traditional High Bandwidth Memory (HBM) implementations, SEMIFIVE's architecture provides superior memory bandwidth, diminished latency, enhanced power efficiency, and reduced overall costs. By minimizing the chip footprint, this solution allows for more compact packaging and offers greater design flexibility across various AI chip applications—ranging from edge devices with stringent space and power limitations, to expansive high-performance data centers.

Currently, SEMIFIVE is rapidly commercializing AI chips that integrate a 4-layer memory stack atop a large logic chip, collaborative efforts with global clients leading this charge. By leveraging proprietary design platforms and a robust global supply chain, SEMIFIVE is poised to meet the escalating demand for next-generation AI chips while enhancing its market presence.

The Big Die Solution: Leading in AI ASIC Capabilities

As the scale and complexity of AI models continue to rise, the need for larger AI chips grows alongside it. SEMIFIVE has developed a robust Big Die Solution that facilitates reliable, large-scale semiconductor design for AI applications, with a focus on showcasing their latest Big Die design advancements at the forum.

A highlight of SEMIFIVE’s recent innovations includes collaboration with AI startup HyperAccel on their groundbreaking project, "Bertha," a processing unit designed for large language model (LLM) applications. Utilizing Samsung Foundry's 4nm (SF4X) process technology, SEMIFIVE has successfully completed the design and verification of a 'Big Die' exceeding 500mm².

According to Brandon Cho,