#United States #Columbus #AI Infrastructure #Vertiv #OCP Global Summit

Vertiv's Innovations for AI Infrastructure

COLUMBUS, Ohio, Oct. 10, 2025 - Vertiv Holdings Co., recognized for its pivotal role in critical digital infrastructure, is set to unveil its latest advancements in cooling, rack, and power technologies designed specifically for high-density, energy-efficient AI environments at the upcoming 2025 OCP Global Summit. These innovations align with the Open Compute Project (OCP) design standards, demonstrating Vertiv’s ongoing commitment to building adaptable and flexible infrastructure tailored for modern AI and computational workloads.

The featured technologies can be observed at Booth #C34 during the summit, scheduled from October 13 to 16. Throughout this event, Vertiv aims to highlight how their integrated solutions address common power and density challenges happening within AI-centric ecosystems.

Among the standout solutions is the Vertiv™ PowerIT rack power distribution unit (PDU), capable of delivering up to 57.6 kW of dependable power distribution. This PDU includes monitored and switched variants, catering to high-density computing environments with advanced management, load balancing, and cybersecurity features. The responsibility of ensuring consistent power delivery is crucial as data centers transition to more robust AI applications.

Another highlight is the Vertiv™ PowerBar Track, a modular overhead power distribution system engineered for high-density AI and High-Performance Computing (HPC) applications. Its design is aimed at optimizing space and simplifying installation through an open-track configuration, providing continuous power functionality. This design ensures business continuity while allowing for future upgrades and component reliability.

Expansion of the Vertiv Solutions Portfolio

The new Vertiv™ SmartIT OCP rack solution showcases versatility, being a configurable high-capacity rack system that simplifies installations for varied server types. This innovative design supports power loads of up to 142 kW, backed by pre-fabricated configurations that encase validated power and cooling options. This presents a quicker deployment process while enhancing overall reliability for users.

In addition, Vertiv will showcase the CoolChip Fluid Network manifolds, part of their advanced liquid cooling portfolio, aimed at efficiently managing thermal loads typical of high-density operational demands. These manifolds work hand-in-hand with the Vertiv™ CoolChip CDU series, signifying continuous progression towards modular, adaptable cooling technologies crucial for AI and cutting-edge computing arrangements.

Potential attendees will also have the opportunity to explore connectivity solutions developed in collaboration with Harting, demonstrating how compact, high-performance cabling can facilitate seamless integration while conserving space. These arrangements are pivotal as they work to efficiently distribute power from the OCP Busway to the Power Distribution Box (PDB), ultimately aiming to maximize usable rack space dedicated to IT equipment.

Vertiv's Vision for OCP Standards

Ramesh Menon, Vice President of IT Systems at Vertiv, elucidated, "Meeting OCP standards transcends mere compliance; it embodies delivering infrastructure that can operate efficiently at scale." By integrating elements such as racks, busways, cabling, and power distribution into a singular ecosystem, Vertiv strives to enhance operational efficiency while reducing deployment times for AI-ready configurations across facilities.

Vertiv's wide-ranging tech portfolio spans critical areas—power, thermal management, IT management, and integrated infrastructure—serving as a foundation for its innovative offerings. The company's exhibition at the OCP Global Summit exemplifies its dedication to establishing open, efficient, and vendor-neutral systems conducive to the future of data center design.

Aside from product showcases, Greg Ratcliff, Chief Innovation Officer, will lead a session titled 'From Concept to Capability: Innovating the Future of OCP Reference Designs'. This presentation aims to deliver insights into how Vertiv transitions initial concepts into viable prototypes, expediting the advancement of open infrastructure.

In conclusion, the insights gained during this summit will position Vertiv as a front-runner in next-generation digital infrastructure, addressing the imperative challenges of data centers that evolve alongside emerging AI demands. For those looking to learn more about these innovative offerings or seeking a consultation with experts, visit Vertiv.com where they provide comprehensive information about their OCP-compliant solutions and the complete suite of infrastructure products available.

About Vertiv
As a prominent entity in critical digital infrastructure, Vertiv provides a holistic assembly of hardware, software, analytics, and ongoing services supporting clients' vital applications. With its operations extending across over 130 countries and headquartered in Westerville, Ohio, Vertiv is dedicated to solving the core challenges facing contemporary data centers and communication networks, from edge cloud capabilities to enterprise-scale solutions. To stay updated on Vertiv's innovations and news, please visit Vertiv.com.