Fibocom and MediaTek Showcase Next-Gen AI-Powered 5G Module at MWC Barcelona 2025

Fibocom and MediaTek: Transforming 5G Connectivity



At Mobile World Congress (MWC) 2025 in Barcelona, Fibocom, a prominent global player in AIoT solutions and wireless communication modules, introduced its groundbreaking FG370 module. This innovative product is based on MediaTek's MTK T830 chipset and is designed to meet the pressing demands of the telecom industry for advanced 5G Fixed Wireless Access (FWA) and Mobile HotSpot (MHS) services.

Key Features of the FG370 Module


The FG370 module showcases cutting-edge features that address the ongoing challenges in providing reliable and high-speed 5G connectivity. Key aspects include:

1. Modem AI Technology: The integration of MediaTek Modem AI (MMAI) significantly enhances the module's capabilities, improving network connectivity in various environments, including high-speed rail, underground settings, and remote areas. These enhancements are crucial, especially for MHS applications, ensuring users enjoy seamless connectivity even in challenging conditions.

2. Three-Antenna Transmission (3Tx): Unlike typical 5G terminals that support two transmission chains, Fibocom's FG370 utilizes 3Tx technology. This advancement allows the module to support three transmission chains, boosting uplink throughput. Lab tests have shown that this can result in a throughput increase of up to 68%, a considerable improvement for users relying on stable and high-speed connectivity.

3. Low Latency, Low Loss, and Scalable Throughput (L4S): The FG370 also incorporates L4S technology, which ensures a network experience characterized by low latency and minimal packet loss. This is particularly beneficial for applications needing quick response times, paving the way for better overall user experience.

4. Dynamic Network Optimization: With an AI-driven approach, the FG370 enhances network search speeds by over 50% in airport environments, showcasing its ability to adapt and optimize in real-time. This adaptability is further highlighted by the AI Hiking Mode, which addresses issues related to weak signals and reduces power consumption by a notable 10%.

Innovations in Diverse Environments


The FG370 isn't just impressive in traditional settings; its applications extend to diverse and challenging environments:
  • - High-Speed Rail: Onboard high-speed trains, the FG370 ensures stable connections, allowing passengers to maintain connectivity throughout their journeys.
  • - Underground Conditions: In subterranean settings, the module enables quick reconnection to 5G signals, which is essential for maintaining service continuity.

The FG370's robust design also supports the latest standards, including 3GPP Rel-17, which improves signal quality at the cell edge and enhances overall network performance.

Collaborative Efforts for Future Development


Evan Su, General Manager of Wireless Communications at MediaTek, emphasized the importance of collaboration between Fibocom and MediaTek in shaping the future of 5G technologies. Both companies are committed to integrating AI within their offerings, aiming to equip global operators with optimized solutions for high-performance and intelligent 5G connectivity.

Simon Tao, VP of MBB Product Management at Fibocom, echoed this sentiment, expressing confidence in their partnership's ability to innovate and advance AI-driven solutions in the FWA and MHS markets.

Through strategic collaborations, Fibocom aims to lead the charge in developing smart, interconnected networks that cater to the growing demands of consumers and businesses alike.

Conclusion


As the telecommunications landscape continues to evolve, the introduction of the FG370 module at MWC Barcelona 2025 marks a pivotal moment in the journey toward realizing the full potential of 5G connectivity. With its dynamic features and advanced technology, Fibocom's FG370 positions itself as a frontrunner in transforming the global FWA and MHS sectors. Visit Fibocom's booth #5I33 at MWC to see firsthand how they are shaping the future of connectivity.

Topics Telecommunications)

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