#USA #Fremont #YES #SkyWater #RapidCure

YES RapidCure Systems: Revolutionizing Semiconductor Packaging

On December 16, 2024, Yield Engineering Systems, Inc. (YES), a major player in advanced packaging solutions for semiconductors, announced a significant development in collaboration with SkyWater Technology (NASDAQ: SKYT). SkyWater has adopted YES's RapidCure polymer dielectric hardening systems for their M-Series™ Fan-out Wafer Level Packaging (FOWLP) technology, which is a groundbreaking alliance in semiconductor packaging processes.

Advancements in Packaging Technology

The need for more efficient and faster semiconductor packaging processes has become increasingly critical with the shrinking line widths and spaces in modern packaging technologies. YES's RapidCure system is designed to meet this challenge by utilizing a unique combination of UV and direct thermal exposure. This advanced technology significantly reduces the process cycle time, making it essential for the rapid development of next-generation semiconductor devices.

The RapidCure process begins with a UV pre-treatment that partially cross-links the polymer, followed by carefully controlled thermal curing. This two-step process allows customers to optimize the thermal budget for both organic and inorganic thin films utilized in a variety of semiconductor applications. Additionally, the efficiency of the RapidCure method provides a notable throughput advantage over traditional polymer curing processes, while maintaining or enhancing dielectric properties.

The Role of SkyWater Technology

SkyWater is recognized as the first domestic licensee of Deca Technologies' M-Series technologies, which supports the ongoing reshaping of the semiconductor supply chain in the U.S. Bassel Haddad, Senior Vice President and General Manager of Advanced Packaging at SkyWater, emphasized that their partnership with YES is crucial for accelerating prototyping services, enhancing reliability, and increasing throughput. SkyWater's implementation of RapidCure technology is expected to streamline the complex curing processes that are often bottlenecks in production.

Industry Impact and Future Applications

Rezwan Lateef, President of YES, expressed excitement about supporting SkyWater’s production growth with their RapidCure technology. He noted that this technology substantially broadens YES’s capabilities in advanced packaging applications. The ability to cure polymers at low temperatures opens up multiple avenues including the curing of underfills, adhesives, and low-k films, which are integral to modern chiplet-based device designs.

Deca’s RapidCure process, originally designed under the leadership of notable industry figures, including TJ Rodgers, the founder of Cypress Semiconductor, is already showing exceptional results. It has been reported to reduce typical curing times from six hours to merely 20 minutes, thus revolutionizing the development cycle for high-density heterogeneous integrations necessary for future semiconductor technologies.

YES's Commitment to Innovation

YES is not just a manufacturer; it’s a provider of sophisticated techniques for material and interface engineering vital across various markets. Their clientele includes top-tier companies developing future solutions for diverse fields like artificial intelligence and high-performance computing. The firm’s portfolio comprises a wide array of high-tech production tools, enabling the creation of innovative materials and packaging solutions necessary for the next generation of semiconductors.

For more information about YES and their state-of-the-art technological contributions, visit YES.tech.

This collaboration between YES and SkyWater signifies a critical milestone in the semiconductor industry, promising enhancements in packaging technology that are vital for meeting the ever-growing demands of the digital age.