#Taiwan #Packaging #Semiconductor #Zhubei #ERS electronic

ERS Electronic Unveils New Demonstration Center in Zhubei

Zhubei, Taiwan - May 8, 2025 – In response to the accelerating demand for panel-level packaging (PLP) in the semiconductor industry, ERS electronic has proudly announced the opening of its latest demonstration center in Zhubei, Taiwan. Known for their pioneering thermal management solutions, this new facility will serve as a vital resource for chip manufacturers and outsourcing services for testing and assembly in Taiwan.

At the core of this initiative is the LUM600S1 machine, designed specifically for photothermal debonding processes. By providing local access to this cutting-edge technology, ERS aims to support Taiwanese companies in their efforts to scale down production costs while enhancing efficiency in semiconductor manufacturing.

The shift towards panel-level packaging has gained momentum in the semiconductor sector, driven by its cost-effectiveness and scalability. According to Dr. Yik Yee Tan, a senior technology and market analyst at Yole Group, the PLP market is anticipated to expand dramatically from $160 million in 2024 to over $600 million by 2030, primarily due to the adoption of advanced packaging solutions. Dr. Tan predicts that by the end of this decade, high-density fan-out technology, bolstered by AI advancements, is expected to capture over 50% of the market share. The anticipated growth in heterogeneous integration and chiplet designs will further fuel the demand for larger form factors that comply with higher density requirements.

For large-sized packages, the efficacy of panel-level packaging promises significant improvements, with surface efficiency rising up to 80%, compared to just 45% with traditional wafer-level packaging (WLP). This remarkable increase positions PLP as a game-changer for future semiconductor applications.

ERS electronic has been at the forefront of this evolution, launching their first panel-level packaging equipment back in 2018. To cater to diverse manufacturing needs, the company now offers a comprehensive lineup of semi-automatic and fully automatic systems, including photothermal debonding machines that facilitate temporary bonding and debonding processes. These advancements play a pivotal role in managing ultra-thin substrates, essential for high-performance computing (HPC) and artificial intelligence applications.

Sébastien Perino, General Manager of ERS Taiwan, emphasized the significance of the LUM600S1, stating, “This solution offers high yield tailored for high-volume production of complex chips integrated within artificial intelligence systems. Our Taiwanese clients can now firsthand experience how photothermal debonding can elevate efficiency, scalability, and profitability.”

For further information regarding the Zhubei demonstration center and the availability of the LUM600S1 for trials and demonstrations, interested parties are encouraged to visit the ERS website to connect with regional sales representatives.

About ERS Electronic

Founded over 50 years ago in Germering, near Munich, ERS electronic GmbH has been a leader in providing innovative thermal management solutions tailored for the semiconductor industry. The company has earned a stellar reputation for its fast and precise thermal chuck systems based on air cooling for wafer testing. Since 2008, ERS has diversified into advanced packaging solutions, making their fully automated and manual debonding and distortion adjustment systems a staple in production workshops for most semiconductor manufacturers and outsourced assembly/test firms globally.