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Acceleronix and IDEMIA Launch IFPP Early Access Program

At the MWC26 in Barcelona, Acceleronix and IDEMIA Secure Transactions, two global leaders in their respective fields, unveiled the Early Access Program for Factory Profile Provisioning (IFPP). This innovative program, conducted in partnership with Tele2 IoT, is set to redefine how manufacturers handle IoT device provisioning, ensuring these devices are ready to connect right off the production line.

The IFPP program provides manufacturers with the ability to pre-load connectivity profiles onto eSIMs during the manufacturing process, simplifying the entire lifecycle of IoT connectivity. Visitors at the MWC26 are encouraged to experience live demonstrations that showcase the capabilities of this groundbreaking solution, designed to speed up global scaling of IoT deployment.

One of the standout features of the IFPP program is its integration of quantum security. This ensures that connectivity profiles are well-protected, even in environments where devices may not be online or are operating in isolation. The provision also supports the latest GSMA specifications, making it adaptable for future advancements in IoT connectivity standards.

Gal Olshinka, the director of Acceleronix, emphasized that their commitment to optimizing device lifecycle and connectivity is at the core of the IFPP initiative. He stated, "This new IFPP Early Access Program demonstrates our dedication to eSIM technology and the streamlining of IoT device provisioning. Together with IDEMIA and Tele2 IoT, we are showcasing how the IFPP can simplify the process for manufacturers, while minimizing operational risks and enabling immediate connectivity from the factory."

Philippe De Oliveira, API Connectivity Senior VP at IDEMIA, also expressed his enthusiasm about the program: "The IFPP marks a pivotal moment for OEMs to optimize the connected device manufacturing process significantly. It's a practical application that's ready for industrial adoption right now. By combining our connective solutions with Acceleronix's factory orchestration capabilities, we are meeting the immediate needs of the market."

The collaboration with Tele2 IoT only enhances the offering, leveraging its connectivity and global managed IoT provisioning capabilities. Tele2 IoT's CEO, Onur Kasaba, remarked, "By joining forces with Acceleronix and IDEMIA, we are bringing to life the IFPP initiative, which drives direct factory-ready devices. This enhances operational simplicity and facilitates secure global implementations of IoT solutions."

Attendees at MWC Barcelona 2026 can get first-hand insights into how the IFPP works and engage with experts from Acceleronix. A live demonstration will highlight the ease with which the program simplifies connectivity provisioning during the manufacturing phase. Additionally, OEMs are invited to join the IFPP Early Access Program, allowing them to test this cutting-edge technology in their own operations.

In summary, the advancements showcased in the IFPP Early Access Program signify a new era of connectivity management for IoT devices, combining high-level security with operational efficiency. As the industry moves towards a more complex and connected future, such collaborative innovations are vital for seamless device integration into global networks.

For more detailed information, you can visit www.acceleronix.io.