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Synopsys and Intel Propel Angstrom-Scale Chip Designs

In a notable development in the semiconductor landscape, Synopsys, Inc. has partnered with Intel Foundry to enhance chip design efficiency across the Intel 18A and Intel 18A-P technologies. This collaboration, unveiled during the Intel Foundry Direct Connect 2025 event, focuses on ushering in state-of-the-art digital and analog design flows that promise to revolutionize the production and capabilities of next-generation chips optimized for artificial intelligence (AI) and high-performance computing (HPC).

The latest EDA (Electronic Design Automation) flows introduced by Synopsys are not just theoretical; they are production-ready and aim to accelerate the adoption of advanced multi-die designs. This is achieved through the integration of Intel’s Embedded Multi-die Interconnect Bridge-T (EMIB-T) packaging technology. The collaboration ensures that designers can leverage Synopsys’ advanced EDA solutions to create highly optimized chips more efficiently.

Breaking Ground in Multi-Die Designs

Intel's EMIB-T technology enhances the interconnect capabilities of multi-die chips, allowing for innovative designs that break the limitations usually presented in traditional chip assembly. The application of Synopsys' 3DIC Compiler alongside these advanced packaging methods represents a significant leap in design functionality and speed. This unified platform enables engineers to work through the complexities of multi-die implementation, facilitating early-stage planning and optimization processes that are crucial in the race to produce cutting-edge semiconductors.

By employing Synopsys' certified AI-driven design flows, manufacturers can implement designs that feature superior power, performance, and area (PPA) metrics—an essential requirement as demand for efficient AI computations and services continues to escalate. During his keynote presentation, John Koeter, Senior Vice President for the Synopsys IP Group, stressed the importance of this partnership in meeting the evolving requirements of the semiconductor industry, specifically targeting increased efficiency for AI and HPC applications.

Synopsys EDA for Next-Level Performance

The optimization across the Intel 18A process node represents not just a technical achievement but also a strategic move towards more sustainable chip production. Employing innovations such as Intel’s PowerVia backside power delivery technology, the collaboration allows designers to extend their capabilities while ensuring that they produce chips with improved thermal characteristics and performance reliability. With integrated enhancements across Synopsys’ IP portfolio, clients are expected to benefit from quicker time-to-market for their AI-optimized chip designs.

As technology advances, Synopsys and Intel are committed to maintaining a competitive edge in design innovation. By engaging in early design technology co-optimization for Intel 14A-E, both companies are preparing for the next levels of performance, ready to address future demands.

Expanding the Ecosystem of Innovation

Synopsys is not merely participating in the existing technology scene but is actively committing to broaden the ecosystem around Intel Foundry. Their recent entry into the Intel Foundry Accelerator Design Services Alliance and the Intel Foundry Accelerator Chiplet Alliance marks a vital step towards fostering additional interoperability and manufacturability for multi-die designs. By joining these alliances, Synopsys is positioning itself as a thought leader in advanced chip design, catering specifically to the intricacies of high-performance AI applications.

Through their extensive portfolio of multi-die design solutions, Synopsys aims to provide clients with the resources needed for interfacing, foundational, and lifecycle management IP on the Intel 18A process node. The collaboration is expected to help achieve greater bandwidth and lower latency in chip operations, crucial for next-generation computing demands.

Conclusion

The collaboration between Synopsys and Intel Foundry signifies a pivotal moment for the semiconductor industry as it transitions toward adopting angstrom-scale technologies. With their combined efforts, the two companies are not only enhancing existing design capabilities but are also paving the way for the future of chip manufacturing tailored to meet the booming demand for AI and high-performance computing solutions. The successes of this initiative could serve as a blueprint for future partnerships across the industry. As the semiconductor landscape continues to evolve, innovations like these will remain at its forefront, driving progress and redefining the possibilities of technology.

Synopsys is set to exhibit and engage with attendees at the Intel Foundry Direct Connect, showcasing the practical applications of these advancements in Silicon Valley, all while emphasizing their commitment to fostering a richer, more innovative tech ecosystem.